Qualcomm’s Oryon processor cores will soon be making their way to the smartphone market. A leaked spec sheet reveals that two models are on the way: the SM8750 and the SM8750P. The “P” presumably stands for “Performance” and could be similar to the “AC” variants we’ve seen on previous Snapdragon chips.
The Snapdragon 8 Gen 4 is built on a 3nm node (instead of 4nm, it should be a TSMC node again). The processor will be in a 2+6 configuration as seen in this Geekbench test, but it is unclear whether it is eight Oryon cores or just two Oryons plus six Cortex cores.
Unlike the Snapdragon X chips, which are aimed at laptops, the 8 Gen 4 has to adapt to the thermal and power limitations of a handheld device. Regardless of configuration, the Gen 4 chip beats the Gen 3 by 35% in single-core tests and 30% in multi-core tests (and that's just an early Geekbench test, so there may be room for improvement).
Regardless, the slide also promises a new Qualcomm Adreno 8-series GPU with performance and efficiency improvements over the 7-series. Additionally, the chip will support quad-channel LPDDR5X RAM.
The “Low-Power AI” (LPAI) subsystem is interesting: it is intended for always-on uses, including audio, camera and sensor tracking. There will of course be a robust NPU for when the device is active.
The Snapdragon 8 Gen 4 will support mmWave and sub-6GHz 5G (Rel. 17), Wi-Fi 7 (802.11be), Bluetooth 5.4, and UWB (FastConnect 7900).
Several brands are building flagships with the Snapdragon 8 Gen 4, but Xiaomi is reportedly aiming to be the first to launch a phone with the new chip. That's expected to be the Xiaomi 15 series, which could be unveiled in October, shortly after the 8 Gen 4 chipset itself (which is officially slated to launch in October).
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